ALLEGRO使用DRC錯(cuò)誤代碼對(duì)照代碼相關(guān)對(duì)象說(shuō)明單一字符代碼LLine走線PPin元件腳VVia貫穿孔KKeep in/out允許區(qū)域/禁止區(qū)域CComponent元件層級(jí)EElectrical Constraint電氣約束JT-Junction呈現(xiàn)T形的走線IIsland Form被Pin或Via圍成的負(fù)片孤銅錯(cuò)誤代碼前置碼說(shuō)明WWire與走線相關(guān)的錯(cuò)誤DDesign與整個(gè)相關(guān)的錯(cuò)誤MSoldemask與防焊層相關(guān)的錯(cuò)誤錯(cuò)誤代碼后置碼說(shuō)明SShape/Stub與走線層的Shape或分支相關(guān)的錯(cuò)誤NNotAllowed與不允許的設(shè)置相關(guān)的錯(cuò)誤WWidth與寬度相關(guān)的錯(cuò)誤雙字符錯(cuò)誤代碼BBBondpad to BondpadBondpad之間的錯(cuò)誤BLBondpad to LineBondpad與Line之間的錯(cuò)誤BSBondpad to ShapeBondpad與Shape 之間的錯(cuò)誤CCPackage to PackagePackage之間的 Spacing 錯(cuò)誤Symbol Soldermask to SymbolSoldermask零件防焊層之間的Spacing 錯(cuò)誤DFDifferential Pair Length Tolerance差分對(duì)走線的長(zhǎng)度誤差過(guò)長(zhǎng)Differential Pair Primary Max Separation差分對(duì)走線的主要距離太大Differential Pair Secondary Max Separation差分對(duì)走線的次要距離太大Differential Pair Secondary Max Length差分對(duì)走線的次要距離長(zhǎng)度過(guò)長(zhǎng)DIDesign Constraint Negative Plane Island負(fù)片孤銅的錯(cuò)誤EDPropagation-Delay走線的長(zhǎng)度錯(cuò)誤Relative-Propagation-Delay走線的等長(zhǎng)錯(cuò)誤ELMax Exposed Length走線在外層（TOP&BOTTOM）的長(zhǎng)度過(guò)長(zhǎng)EPMax Net Parallelism Length-Distance Pair已超過(guò)Net之間的平行長(zhǎng)度ESMax Stub Length走線的分支過(guò)長(zhǎng)ETElectrical Topology走線連接方式的錯(cuò)誤EVMax Via Count已超過(guò)走線使用的VIA的最大數(shù)目EXMax Crosstalk已超過(guò)Crosstalk值Max Peak Crosstalk已超過(guò)Peak Crosstalk值HHHold to Hold Spacing鉆孔之間的距離太近HWDiagonal Wire to Hold Spacing斜線與鉆孔之間的距離太近Hold to Orthogonal Wire Spacing鉆孔與垂直/水平線之間的距離太近IMImpedance Constraint走線的阻抗值錯(cuò)誤JNT Junction Not Allowed走線呈T形的錯(cuò)誤KBRoute Keepin to BondpadBondpad在Keepin之外Route keepoutto BondpadBondpad在keepout之內(nèi)Via KeepouttoBondpadBondpad在Via Keepout之內(nèi)KCPackage to Place Keepin Spacing元件在Place Keepin之外Package to Place Keepout Spacing元件在Place Keepout之內(nèi)KLLine to Route Keepin Spacing走線在Route Keepin之外Line to Route Keepout Spacing走線在Route Keepout之內(nèi)KSShape to Route Keepin SpacingShape在Route Keepin之外Shape to Route Keepout SpacingShape在Route Keepout之內(nèi)KVBBVia to Route Keepin SpacingBBVia在Route Keepin之外BBVia to Route Keepout SpacingBBVia在Route Keepout之內(nèi)BBVia to Via Keepout SpacingBBVia在Via Keepout之內(nèi)Test Via to Route Keepin SpacingTest Via在Route Keepin之外Test Via to Route Keepout SpacingTest Via在Route Keepout之內(nèi)Test Via to Via Keepout SpacingTest Via在Via Keepout之內(nèi)Through Via to Route Keepin SpacingThrough Via在Route Keepin之外Through Via to Route Keepout SpacingThrough Via在Route Keepout之內(nèi)Through Via to Via Keepout SpacingThrough Via在Via Keepout之內(nèi)LBMin Self Crossing Loopback Length無(wú)LLLine to Line Spacing走線之間太近LSLine to Shape Spacing走線與Shape 太近LWMin Line Width走線的寬度太細(xì)Min Neck Width走線變細(xì)的寬度太細(xì)MASoldermask Alignment Error PadSoldermask Tolerance太小MCPin/Via Soldermask to Symbol SoldermaskPad與Symbol Soldermask之間的錯(cuò)誤MMPin/Via Soldermask to Pin/Via SoldermaskPad Soldermask之間的錯(cuò)誤PBPin to BondpadPin與Bondpad之間的錯(cuò)誤PLLine to SMD Pin Spacing走線與SMD元件腳太近Line to Test Pin Spacing走線與Test元件腳太近Line to Through Pin Spacing走線與Through元件腳太近PPSMD Pin to SMD Pin SpacingSMD元件腳與SMD元件腳太近SMD Pin to Test Pin SpacingSMD元件腳與Test元件腳太近Test Pin to Test Pin SpacingTest元件腳與Test元件腳太近Test Pin to Through Pin SpacingTest元件腳與Through元件腳太近Through Pin to SMD Pin SpacingThrough元件腳與SMD元件腳太近Through Pin to Through Pin SpacingThrough元件腳與Through元件腳太近PSShape to SMD Pin SpacingShape與SMD元件腳太近Shape to Test Pin SpacingShape與Test元件腳太近Through Pin to Shape SpacingThrough元件腳與Shape太近PVBBVia to SMD Pin SpacingBBVia與SMD元件腳太近BBVia to Test Pin SpacingBBVia與Test元件腳太近BBVia to Through Pin SpacingBBVia 與Through元件腳太近SMD Pin to Test Via SpacingSMD Pin與Test Via太近SMD Pin to Through Via SpacingSMD Pin與Through Via太近Test Pin to Test Via SpacingTest Pin與Test Via太近Test Pin to Through Via SpacingTest Pin與Through Via太近Test Via to Through Pin SpacingTest Via與Through Pin太近Through Pin to Through Via SpacingThrough Pin與Through Via太近RCPackage to Hard Room元件在其他的Room之內(nèi)REMin Length Route End Segment at 135Degree無(wú)Min Length Route End Segment at 45/90Degree無(wú)SB135Degree Turn to Adjacent Crossing Distance無(wú)90Degree Turn to Adjacent Crossing Distance無(wú)SLMin Length Wire Segment無(wú)Min Length Single Segment Wire無(wú)SNAllow on Etch Subclass允許在走線層上SOSegment Orientaion無(wú)BBBondpad to BondpadBondpad之間的錯(cuò)誤SSShape to ShapeShape之間的錯(cuò)誤TAMax Turn Angle無(wú)VBVia to BondpadVia 與Bondpad之間的錯(cuò)誤VGMax BB Via Stagger Distance同一段線的BB Via之間的距離太長(zhǎng)Min BB Via GapBB Via之間太近Min BB Via Stagger Distance同一段線的BB Via之間的距離太近Pad/Pad Direct ConnectPad 在另一個(gè)Pad 之上VLBB Via to Line SpacingBB Via與走線太近Line to Through Via Spacing走線與Through Via太近Line to Test Via Spacing走線與Test Via太近VSBB Via to Shape SpacingBB Via與Shape太近Shape to Test Via SpacingShape 與Test Via太近Shape to Through Via SpacingShape與Through Via太近VVBB Via to BB ViaSpacingBB Via之間太近BB Via to Test Via SpacingBB Via與Test Via太近BB Via to Through Via SpacingBB Via與Through Via太近Test Via to Test Via SpacingTest Via之間太近Test Via to Through Via SpacingTest Via與Through Via太近Through Via to Through Via SpacingThrough Via之間太近WAMin Bonding Wire LengthBonding Wire 長(zhǎng)度太短WEMin End Segment Length無(wú)Min Length Wire End Segment at 135Degree無(wú)Min Length Wire End Segment at 45/90Degree無(wú)WIMax Bonding Wire LengthBonding Wire 長(zhǎng)度太長(zhǎng)WWDiagonal Wire to Diagonal Wire Spacing斜線之間太近Diagonal Wire to Orthogonal Wire Spacing斜線與垂直/水平線之間的距離太近Orthogonal Wire to Orthogonal Wire Spacing垂直/水平線之間的距離太近WXMax Number of Crossing無(wú)Min Distance between Crossing無(wú)XB135 Degree Turn to Adjacent Crossing Distance無(wú)90 Degree Turn to Adjacent Crossing Distance無(wú)XDExternally Determined Violation無(wú)XSCrossing to Adjacent Segment Distances無(wú)