半導(dǎo)體封裝材料市場(chǎng)在2009年收縮，出貨量及材料消耗量在今年二季度開(kāi)始恢復(fù)，并且有望延續(xù)到四季度。塑料封裝材料（包括熱介面材料）預(yù)計(jì)將達(dá)到158億美元，較2008年的172億美元下降8%。由于材料消耗量的增加，該市場(chǎng)有望在2010年達(dá)到176億美元，到2013年達(dá)到201億美元。對(duì)于封裝材料市場(chǎng)的關(guān)鍵部分來(lái)說(shuō)，直到2011年，市場(chǎng)將穩(wěn)步增長(zhǎng)。

Packaging Material Segment主要封裝材料

半導(dǎo)體封裝市場(chǎng)的增長(zhǎng)領(lǐng)域包括：倒裝芯片、晶圓級(jí)封裝、BGA球柵列陣、應(yīng)用引線(xiàn)框架的芯片級(jí)封裝(CSP)、堆疊芯片封裝以及系統(tǒng)級(jí)封裝/多芯片封裝。隨著應(yīng)用需求的不斷增加，越來(lái)越多傳統(tǒng)的封裝技術(shù)將運(yùn)用于實(shí)際產(chǎn)品中。

在不斷推進(jìn)封裝技術(shù)的過(guò)程中，現(xiàn)有材料的改進(jìn)以及新興材料的發(fā)展都是十分關(guān)鍵的。以下為部分觀(guān)察報(bào)告：

1.有機(jī)基板

對(duì)于有機(jī)襯底材料來(lái)說(shuō)，倒裝芯片應(yīng)用取得了卓越進(jìn)步。倒裝PBGA的成長(zhǎng)驅(qū)動(dòng)主要來(lái)自于對(duì)電性能，芯片上電源分布以及日益受限的Pad設(shè)計(jì)的需求。波形系數(shù)及需求一直驅(qū)動(dòng)著處理器及無(wú)線(xiàn)應(yīng)用設(shè)備中線(xiàn)焊到倒裝芯片的轉(zhuǎn)換。未來(lái)幾年，隨著供應(yīng)的增加以及不斷改善的材料利用率及生產(chǎn)良率，基板價(jià)格有望下降。

2.引線(xiàn)框架

目前在引線(xiàn)框架生產(chǎn)過(guò)程中，生產(chǎn)商專(zhuān)注于提升電鍍及表面處理能力，以滿(mǎn)足產(chǎn)品的濕度敏感性要求。由于銅的價(jià)格不斷上漲，供應(yīng)商不斷評(píng)估新材料以降低成本。部分引線(xiàn)框架廠(chǎng)商采用中國(guó)本土企業(yè)生產(chǎn)的引線(xiàn)框架合金作為生產(chǎn)的原材料。

3.塑封料

設(shè)備商及封裝廠(chǎng)商強(qiáng)調(diào)了低K電介質(zhì)設(shè)備的兼容性、超細(xì)間距引線(xiàn)，銅鍵合絲對(duì)于塑封材料的發(fā)展也極為重要，需要利用塑封料來(lái)改善較薄以及堆疊封裝中的翹曲。改善塑封料對(duì)于傳統(tǒng)的傳遞型封裝技術(shù)中的細(xì)間距填充，包括過(guò)模壓填充應(yīng)用來(lái)說(shuō)，是必要的。

4.鍵合絲

金線(xiàn)供應(yīng)商正積極發(fā)展合金線(xiàn)、控制金屬微觀(guān)結(jié)構(gòu)屬性來(lái)滿(mǎn)足不同封裝設(shè)計(jì)及form factor中的可靠性需求。而關(guān)系到供應(yīng)商及他們客戶(hù)的切身問(wèn)題是不斷上漲的金價(jià)。因此，不斷向更小直徑轉(zhuǎn)移的金線(xiàn)成為了引人關(guān)注的焦點(diǎn)，近70%的出貨金線(xiàn)均是直徑小于25微米。銅金線(xiàn)的使用已越來(lái)越頻繁，已占總鍵合絲市場(chǎng)的5%以上。

目前對(duì)于新材料發(fā)展的趨勢(shì)和驅(qū)動(dòng)力就是產(chǎn)業(yè)范圍內(nèi)降低半導(dǎo)體封裝的成本壓力。所有的封裝材料市場(chǎng)都面臨著發(fā)展低成本解決方案的壓力。供應(yīng)鏈上的各個(gè)企業(yè)需要共同協(xié)作來(lái)推動(dòng)新材料的發(fā)展及成本降低。

所有信息均來(lái)自最近SEMI與TechSearch International合作出版的市場(chǎng)調(diào)研“全球半導(dǎo)體封裝材料市場(chǎng)展望──2009-2010版”。報(bào)告深度采訪(fǎng)了全球超過(guò)140家半導(dǎo)體制造商、封裝及封裝材料供應(yīng)商。

若需訂閱“全球半導(dǎo)體封裝材料市場(chǎng)展望──2009-2010版”，請(qǐng)聯(lián)系Dr. Dan P. Tracy, research development director, Industry Research and Statistics, SEMI ，email at dtracy@semi.org

電話(huà)：1.408.943.7987 傳真：1.408.943.7915。

Growing Packaging Materials Market under Pressure

Cost Reduction Pressures Impact the Market

By Jan Vardaman, TechSearch International, and Dan Tracy, SEMI

While the semiconductor packaging materials market will contract in 2009, a recovery in unit shipments and materials consumption occurred in the second quarter of the year and looks to continue through the fourth quarter. As a result, plastic packaging materials (including thermal interface materials) will be an estimated $15.8 billion, down 8% from the $17.2 billion reported in 2008. This market is forecast to reach $17.6 billion in 2010 and grow to $20.1 billion by 2013 as material consumption is projected to increase. Steady unit growth is expected through 2011 for key segments of the packaging materials market.

Packaging Material Segment

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Going forward, semiconductor packaging growth areas include flip chip, wafer-level packaging (WLP), ball grid array (BGA), leadframe-based chipscale packaging (CSP), stacked die packages, and system-in-package (SiP)/multichip packages. More traditional packaging technologies will see demand continue to increase for some applications, though stagnant in others and, for some basic form factors, to continue to decline. Improvements in existing materials and the development of new materials are critical in advancing packaging technologies. Here are some observations for specific segments:

1. Organic Substrates

For the organic substrate materials, flip chip applications have grown dramatically. The drivers for flip chip PBGAs continue to be electrical performance, on-chip power distribution, and pad limited designs. Form factor and performance are driving the shift from wire bond to flip chip for processors and other devices used in wireless applications. Over the next several years, substrate prices are expected to decline as a result of increased supply and improved material utilization and yield.

2. Leadframes

On-going technological enhancements in leadframe manufacturing focus on plating and surface treatment technologies in an effort to achieve desired moisture sensitivity specifications for packages. Suppliers continue to report the evaluation of new materials to lower costs in light of rising copper prices. Part of this is assessing and using leadframe alloys supplied by China-based companies.

3. Mold Compounds

Input from device makers and packaging subcontractors highlight compatibility with low-k dielectric devices, fine and high-density pitch wire, as well as copper bonding wire as important areas for on-going materials development for mold compounds. Materials are needed to reduce warpage in thin and stacked packages. Improved mold compounds are required for thin gap filling for conventional transfer mold technology, including over-molded underfill applications.[!--empirenews.page--]

4. Bonding Wire

Wire suppliers continue to develop new wire alloys and control metal microstructures with properties to meet the various, yet demanding requirements in processing and packaging reliability for differing packaging designs and form factors. Of concern to suppliers and their customers is the rising price of gold metal. As a result, the migration to smaller diameter wire has been noticeable with almost 70% of the wire shipped less than 25 micron in diameter. Use of copper wire is increasing and it now represents over 5 percent of the total wire market.

Clearly entwined with the trends and drivers for new materials development are the industry-wide pressures to reduce the cost of electronics and semiconductor packages.

All segments of the packaging materials market are under pressure to develop lower cost solutions. Companies across the supply chain will need to collaborate to balance the needs of new materials development and cost reduction efforts.

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All of the information in this article was derived from a recently completed market research study, Global Semiconductor Packaging Materials Outlook—2009-2010 Edition, produced by SEMI and TechSearch International. In developing this report, over 140 in-depth interviews were conducted with semiconductor manufacturers, packaging subcontractors and packaging materials suppliers throughout the world.

TO ORDER YOUR COPY of Global Semiconductor Packaging Materials Outlook—2009-2010 Edition, please contact Dr. Dan P. Tracy, research development director, Industry Research and Statistics, SEMI via email at dtracy@semi.org, or telephone 1.408.943.7987 or facsimile 1.408.943.7915. You can also click here for sample, pricing, and ordering information.